IEEE/ACM International Symposium on Quality of Service
19–21 June 2024 // Guangzhou, China

Technical Program Committee

Abderrahim Benslimane, University of Avignon, France

Amir Taherkordi, University of Oslo, Norway

Arsalan Ahmad, Iowa State University, USA

Baochun Li, University of Toronto, Canada

Beichuan Zhang, University of Arizona, USA

Canhui Wang, Huaqiao University, China

Chaocan Xiang, Chongqing University, China

Chen Chen, Shanghai Jiao Tong University, China

Chen Ma, City University of Hong Kong, Hong Kong

Chen Qian, University of California at Santa Cruz, USA

Chengjian Liu, Shenzhen Technology University, China

Chi Lin, Dalian University of Technology, China

Chuan Wu, The University of Hong Kong, Hong Kong

Dan Li, Tsinghua University, China

Dan Wang, The Hong Kong Polytechnic University, Hong Kong

Danda B. Rawat, Howard University, USA

David Yau, Singapore University of Technology and Design, Singapore

Debiao He, Wuhan University, China

Deke Guo, National University of Defense Technology, China

Deze Zeng, China University of Geosciences, China

Di Niu, University of Alberta, Canada

Di Wu, Sun Yat-sen University, China

Dimitris Chatzopoulos, University College Dublin, Ireland

Domenico Ciuonzo, University of Naples Federico II, Italy

Eduardo Cerqueira, Federal University of Para & UCLA, Brazil

Eirini Eleni Tsiropoulou, University of New Mexico, USA

Fangming Liu, Huazhong University of Science and Technology, China

Fangxin Wang, The Chinese University of Hong Kong, Shenzhen, China

Feng Li, Shandong Universiy, China

Feng Wang, University of Mississippi, USA

Gareth Tyson, The Hong Kong University of Science and Technology, Hong Kong

Giampaolo Bovenzi, University of Napoli Federico II, Italy

Giuseppe Di Modica, University of Bologna, Italy

Go Hasegawa, Tohoku University, Japan

Gongming Zhao, University of Science and Technology of China, China

Guoming Tang, Peng Cheng Laboratory, China

Hai Liu, The Hang Seng University of Hong Kong, Hong Kong

Haipeng Dai, Nanjing University, China

Haisheng Tan, University of Science and Technology of China, China

Haiyang Wang, University of Minnesota at Duluth, USA

Han Qiu, Tsinghua University, China

Haoyu Song, Futurewei Technologies, USA

Hiroshi Shigeno, Keio University, Japan

Hongbo Liu, Electronic Science and Technology of China, China

Hongfei Xue, University of North Carolina at Charlotte, USA

Houbing H Song, University of Maryland, Baltimore County, USA

Huangxun Chen, Hong Kong University of Science and Technology (Guangzhou), China

Huanle Xu, University of Macau, Macao

Hui Cai, Nanjing University of Posts and Telecommunications, China

Jia Liu, The Ohio State University, USA

Jia Liu, Nanjing University, China

Jia Zhang, Zhongguancun Laboratory, China

Jiahui Hou, University of Science and Technology of China, China

Jianfeng Guan, Beijing University of Posts and Telecommunications, China

Jiaqi Zheng, Nanjing University, China

Jie Cui, Anhui University, China

Jie Wu, Temple University, USA

Jie Yang, Florida State University, USA

Jinsong Han, Zhejiang University, China

JongWon Kim, Gwangju Institute of Science & Technology, Korea (South)

Jun Li, University of Oregon, USA

Jun Zhao, Nanyang Technological University, Singapore

Kai Bu, Zhejiang University, China

Kaigui Bian, Peking University, China

Kaiping Xue, University of Science and Technology of China, China

Kasthuri Jayarajah, University of Maryland Baltimore County, USA

Ke Xu, Tsinghua University, China

Kui Wu, University of Victoria, Canada

Kun Xie, Hunan University, China

Laizhong Cui, Shenzhen University, China

Lan Wang, University of Memphis, USA

Lan Zhang, University of Science and Technology of China, China

Lei Jiao, University of Oregon, USA

Lei Zhang, Shenzhen University, China

Li Lu, Zhejiang University, China

Lin Gu, Huazhong University of Science and Technology, China

Lin Wang, Paderborn University, Germany

Linghe Kong, Shanghai Jiao Tong University, China

Lu Liu, University of Leicester, United Kingdom (Great Britain)

Mariano Scazzariello, KTH Royal Institute of Technology, Sweden

Meng Shen, Beijing Institute of Technology, China

Miao Pan, University of Houston, USA

Michiaki Hayashi, KDDI Corporation, Japan

Mikael Gidlund, Mid Sweden University, Sweden

Nakjung Choi, Nokia, USA

Panlong Yang, University of Science and Technology of China, China

Pengfei Wang, Dalian University of Technology, China

Qiao Xiang, Xiamen University, China

Qingyu Liu, Peking University, China

Qiulin Lin, City University of Hong Kong, China

Rongfei Zeng, Northeastern University, China

Rongxing Lu, University of New Brunswick, Canada

Rui Tan, Nanyang Technological University, Singapore

Ruidong Li, Kanazawa University, Japan

Ruipeng Gao, Beijing Jiaotong University, China

Ruiting Zhou, Southeast University, China

Sajal K. Das, Missouri University of Science and Technology, USA

Sangheon Pack, Korea University, Korea (South)

Serge Fdida, Sorbonne University, France

Shaohuai Shi, Harbin Institute of Technology, Shenzhen, China

Shengzhong Liu, Shanghai Jiao Tong University, USA

Shigeng Zhang, Central South University, China

Shizhen Zhao, Shanghai Jiao Tong University, China

Shuang-Hua Yang, University of Reading, United Kingdom (Great Britain)

Simone Silvestri, University of Kentucky, USA

Song Yang, Beijing Institute of Technology, China

Songqing Chen, George Mason University, USA

Tian Pan, Beijing University of Posts and Telecommunications, China

Tianxi Ji, Texas Tech University, USA

Tilman Wolf, University of Massachusetts Amherst, USA

Tingting Yuan, Georg-August-University of Göttingen, Germany

Tong Li, Renmin University of China, China

Torsten Ingo Braun, University of Bern, Switzerland

Wei Gong, University of Science and Technology of China, China

Wei Wang, Hong Kong University of Science and Technology, Hong Kong

Wendong Wang, Beijing University of Posts and Telecommunications, China

Wenping Liu, Hubei University of Economics, China

Xi Chen, Huawei Canada, Canada

Xianhao Chen, University of Hong Kong, China

Xiaofei Wang, Tianjin University, China

Xiaolong Zheng, Beijing University of Posts and Telecommunications, China

Xiaoming Fu, University of Goettingen, Germany

Xiaoxi Zhang, Sun Yat-sen University, China

Xiapu Luo, The Hong Kong Polytechnic University, Hong Kong

Xinggong Zhang, Peking University, China

Yacine Ghamri-Doudane, University of la Rochelle, France

Yan Wang, Temple University, USA

Yangfan Zhou, Fudan University, China

Yanmin Zhu, Shanghai Jiao Tong University, China

Yaodong Huang, Shenzhen University, China

Ye Tian, Beijing University of Posts and Telecommunications, China

Yi Wang, Southern University of Science and Technology, China

Yifei Zhu, Shanghai Jiao Tong University, China

Yuan He, Tsinghua University, China

Yuan Wu, University of Macau, Macao

Yuanyuan Yang, Stony Brook University, USA

Yuben Qu, Nanjing University of Aeronautics and Astronautics, China

Yuchao Zhang, Beijing University of Posts and Telecommunications, China

Yuedong Xu, Fudan University, China

Yunhuai Liu, Peking University, China

Yupeng Li, Hong Kong Baptist University, Hong Kong

Zehua Guo, Beijing Institute of Technology, China

Zeqi Lai, Tsinghua University, China

Zhangyu Guan, University at Buffalo, USA

Zhe Peng, The Hong Kong Polytechnic University, Hong Kong

Zheng Song, University of Michigan at Dearborn, USA

Zhengguo Sheng, University of Sussex, United Kingdom (Great Britain)

Zhenjiang Li, City University of Hong Kong, Hong Kong

Zhi Liu, The University of Electro-Communications, Japan

Zhi Zhou, Sun Yat-sen University, China

Ziyi Wang, Beijing University of Posts and Telecommunications, China

Zongpeng Li, Tsinghua University, China

Patrons